Press Room
MediaTek Officially Launches Dimensity 9000 Flagship Chip And Announces Adoption by Global Device Makers
16 Dec 2021 - 15:00
HSINCHU, Taiwan – December 16, 2021 –MediaTektoday launched itsDimensity 90005G smartphone chip for next-generation flagship smartphones, and announced device maker adoption and endorsements from some of the world’s biggest smartphone brands, including OPPO, vivo, Xiaomi and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year.
MediaTek and TSMC Unveil the World’s First 7nm 8K Digital TV System-on-Chip
22 Nov 2021 - 15:00
Laguna Beach, Calif. – November 22, 2021 – MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today unveiled the world’s first 7-nanometer 8K digital TV flagship system-on-chip (SoC), the MediaTek Pentonic 2000. Built with TSMC’s N7 advanced process technology, the MediaTek Pentonic 2000 offers unparalleled performance and power efficiency with features including powerful artificial...
MediaTek Announces New Pentonic Smart TV Family with New Pentonic 2000 for Flagship 8K 120Hz TVs
19 Nov 2021 - 03:45
Laguna Beach, Calif. – November 19, 2021 – MediaTek today unveiled its new Pentonic smart TV family with the introduction of the Pentonic 2000, which will power next generation flagship 8K TVs. The MediaTek Pentonic smart TV series is built on MediaTek’s innovative technologies in display, audio, AI, broadcasting and connectivity. Today MediaTek powers more than two billion TVs in the global...
MediaTek Announces New Filogic 130 and Filogic 130A Single-chip Solutions to Bring Wi-Fi 6 and Bluetooth 5.2 Connectivity to IoT Devices
18 Nov 2021 - 05:00
Laguna Beach, Calif. – November 18, 2021 – MediaTek today announced the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip. Filogic 130A also integrates an audio digital signal processor to allow device makers to easily add voice...
AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences
18 Nov 2021 - 05:00
Laguna Beach, Calif. – November 18, 2021 – MediaTek and AMD (NASDAQ: AMD) today announced a collaboration to co-engineer industry leading Wi-Fi® solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds...
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi Products to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan – October 15, 2021 – MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
MediaTek Becomes First Company in Taiwan to Complete Authoritative Global Information Security Assessment BSIMM
14 Oct 2021 - 09:00
HSINCHU, Taiwan – October 14, 2021 – MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in Taiwan to be assessed using the authoritative security evaluation system. MediaTek has also been authorized by MITRE to assign Common Vulnerabilities and Exposures (CVE) as a CVE Numbering...
MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips
30 Sep 2021 - 02:15
HSINCHU, Taiwan – September 30, 2021 – MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek’s new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in...
MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks
09 Sep 2021 - 15:00
HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio™ 900T chipset, expanding MediaTek's portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets
27 Jul 2021 - 14:30
HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to tablets with advanced 5G, multimedia, AI and gaming technologies for a premium user experience. Kompanio 1300T allows OEMs to build powerful,...
MediaTek Launches Helio G96 and Helio G88 SoCs Bringing Advanced Display and Photography Capabilities to Premium Smartphones
15 Jul 2021 - 13:30
HSINCHU, Taiwan – July 15, 2021 – MediaTek today announced two additions to its Helio G series: Helio G96 and Helio G88. The launch of these system-on-chips (SoCs) will give device makers the ability to provide powerful smartphone features with cutting-edge display and photography capabilities to bring intelligent mobile experiences to every customer.
MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences
29 Jun 2021 - 08:30
HSINCHU, Taiwan – June 29, 2021 – MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market segments. The open resource architecture gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units...
MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software
19 May 2021 - 12:00
New Delhi, – May 19, 2021 – MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, to accelerate the development of an Edge-AI Enabled Smart Device Eco-system. Tessolve launched the MAGIK2 family nano System on module (SoM)...
MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
13 May 2021 - 15:00
HSINCHU, Taiwan – May 13, 2021 – MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.
China Mobile Collaborates with Intel, HP and MediaTek to Deliver 5G Connected Modern PC Experiences to World’s Largest Network
13 May 2021 - 13:00
HSINCHU, Taiwan — May 13, 2021 — China Mobile will join forces with HP, Intel and MediaTek to collaborate on 5G-enabled PCs for the next-generation of connected modern PC experiences.
MediaTek and Samsung Introduce World’s First Wi-Fi 6E Enabled 8K TV
06 Apr 2021 - 21:00
HSINCHU, Taiwan – April 6, 2021 – MediaTek and Samsung today introduced the world’s first 8K QLED TV – the flagship Samsung 8K QLED Y21 – powered by MediaTek’s MT7921AU, delivering the fastest connectivity experiences through its cutting-edge Wi-Fi 6E capabilities. Following their announcement of the world’s first Wi-Fi 6 enabled 8K TV in 2020, MediaTek and Samsung are yet again driving the smart...
MediaTek Wi-Fi 6 Chipset Powers New ASUS Gaming Notebooks
17 Mar 2021 - 21:00
HSINCHU, Taiwan – March 17, 2021 – MediaTek today announced its MT7921 Wi-Fi 6 chipset is powering ASUS Republic of Gamers (ROG) and The Ultimate Force (TUF) new gaming notebooks, the first consumer notebooks with MediaTek’s industry leading Wi-Fi 6 connectivity solution.
MediaTek’s MT9638 4K Smart TV Chip Ushers in a New Era of AI-Enabled Interactive Multimedia Experiences
03 Mar 2021 - 15:00
HSINCHU, Taiwan – March 3, 2021 – MediaTek today announced its new 4K smart TV chip, the MT9638, with an integrated high-performance AI processing unit (APU). MT9638 supports cutting-edge AI-enhancement technologies such as AI super resolution, AI picture quality and AI voice assistants, plus variable refresh rate (VRR) and MEMC (motion estimation and motion compensation) so graphics appear...
MediaTek Unveils New M80 5G Modem with Support for mmWave and Sub-6 GHz 5G Networks
02 Feb 2021 - 07:00
HSINCHU, Taiwan – February 2, 2021 – MediaTek today announced its new M80 5G modem which combines mmWave and sub-6 GHz 5G technologies onto a single chip. The M80 supports ultra-fast speeds on both non-standalone (NSA) and standalone (SA) architectures, with a peak rate of 7.67 Gbps in the downlink and 3.76 Gbps in the uplink. The M80 also supports dual 5G SIM, dual 5G NSA and SA networks, and...
MediaTek, Swisscom, Ericsson and OPPO Enable 5G Carrier Aggregation and Voice over New Radio
26 Jan 2021 - 15:00
HSINCHU, Taiwan – January 26, 2021 – MediaTek today announced it has reached a 5G carrier aggregation (CA) and Voice over New Radio (VoNR) milestone in collaboration with Swisscom, Ericsson and OPPO, advancing 5G networks across Europe.
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
20 Jan 2021 - 15:20
HSINCHU, Taiwan – January 20, 2021 – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line...
MediaTek Selected for Wi-Fi Alliance’s Wi-Fi 6E Certification Program and Expands Its Broad Connectivity Portfolio with New Wi-Fi 6E Solutions
07 Jan 2021 - 22:00
HSINCHU, Taiwan – January 7, 2021 – MediaTek today announced it has been selected to be on the test bed for Wi-Fi 6E, a new certification from Wi-Fi Alliance® for Wi-Fi CERTIFIED 6™ devices with 6GHz support. MediaTek has both an access point wireless solution, MT7915-AP-AX, and a client-side wireless solution, MT7915-STA-AX on the test bed. These two test bed devices support unlicensed operation...
